Inventor
NO GA HYUN
KR3 patents
Patents
3 patentsUS9437580B1Sep 6, 2016
Semiconductor packages with metal posts, memory cards including the same, and electronic systems including the same
SK HYNIX INC11 citations78
US10497671B2Dec 3, 2019
Semiconductor packages including chip stacks
SK HYNIX INC3 citations68
US9412690B2Aug 9, 2016
Package substrates, packages including the same, methods of fabricating the packages with the package substrates, electronic systems including the packages, and memory cards including the packages
SK HYNIX INC0 citations50