P

Inventor

ARAI KIYOSHI

JP44 patents
⚠️ This page may combine multiple inventors who share the name “ARAI KIYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

17 patents
US5767579AJun 16, 1998

Semiconductor device having an electrical connection between a control electrode and a resistive layer

MITSUBISHI ELECTRIC CORP39 citations92
US5686758ANov 11, 1997

Semiconductor device having integral structure of case and external connection terminals

MITSUBISHI ELECTRIC CORP44 citations92
US5424579AJun 13, 1995

Semiconductor device having low floating inductance

MITSUBISHI ELECTRIC CORP41 citations92
US5291065AMar 1, 1994

Semiconductor device and method of fabricating semiconductor device

MITSUBISHI ELECTRIC CORP99 citations91
US5761040AJun 2, 1998

Semiconductor device

MITSUBISHI ELECTRIC CORP43 citations87
US6841866B2Jan 11, 2005

Power semiconductor device

MITSUBISHI ELECTRIC CORP14 citations83
US6552429B2Apr 22, 2003

Power switching semiconductor device with suppressed oscillation

MITSUBISHI ELECTRIC CORP8 citations73
US7859079B2Dec 28, 2010

Power semiconductor device

MITSUBISHI ELECTRIC CORP6 citations70
US11901326B2Feb 13, 2024

Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP0 citations61
US7989227B2Aug 2, 2011

Method of manufacturing semiconductor chip and semiconductor module

MITSUBISHI ELECTRIC CORP2 citations59
US7479693B2Jan 20, 2009

Arrangement of conductive connectors in a power semiconductor device

MITSUBISHI ELECTRIC CORP4 citations59
US12538811B2Jan 27, 2026

Semiconductor device comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, semiconductor device group comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, and power conversion apparatus comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin

MITSUBISHI ELECTRIC CORP0 citations57
US10522482B2Dec 31, 2019

Semiconductor device manufacturing method comprising bonding an electrode terminal to a conductive pattern on an insulating substrate using ultrasonic bonding

MITSUBISHI ELECTRIC CORP1 citations53
US8039936B2Oct 18, 2011

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations52
US10475721B2Nov 12, 2019

Power semiconductor device and method for manufacturing same

MITSUBISHI ELECTRIC CORP0 citations51
US10283430B2May 7, 2019

Power semiconductor device and method for manufacturing same

MITSUBISHI ELECTRIC CORP0 citations51
US9171773B2Oct 27, 2015

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations51

SONY CORP

6 patents

MITSUI TOATSU CHEMICALS

5 patents

HITACHI LTD

4 patents

FUJI HEAVY IND LTD

2 patents

MITSUI CHEMICALS INC

2 patents

ARAI KIYOSHI

2 patents

FUJITSU LTD

1 patent

HONDA MOTOR CO LTD

1 patent

HINO YASUNARI

1 patent

ALSTOM TRANSPORT SA

1 patent

DAIICHI SANKYO CO LTD

1 patent

KAWASHIMA TETSUJI

1 patent