Inventor

NAKASU YASUFUMI

JP3 patents

Patents

3 patents

US6213356B1Apr 10, 2001

Bump forming apparatus and bump forming method

MITSUBISHI ELECTRIC CORP32 citations91

US5305944AApr 26, 1994

Bonding method and bonding apparatus

MITSUBISHI ELECTRIC CORP31 citations90

US6854671B2Feb 15, 2005

Nozzle for ejecting molten metal

MITSUBISHI ELECTRIC CORP0 citations50