Inventor
CURCIO BRIAN EUGENE
US3 patents
Patents
3 patentsUS6452117B2Sep 17, 2002
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
IBM76 citations95
US6581280B2Jun 24, 2003
Method for filling high aspect ratio via holes in electronic substrates
IBM40 citations91
US6570102B2May 27, 2003
Structure for high speed printed wiring boards with multiple differential impedance-controlled layer
IBM26 citations90