Inventor
ARNOLD JOHN C
US42 patents
⚠️ This page may combine multiple inventors who share the name “ARNOLD JOHN C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
20 patentsUS10707413B1Jul 7, 2020
Formation of embedded magnetic random-access memory devices
IBM46 citations95
US10833257B1Nov 10, 2020
Formation of embedded magnetic random-access memory devices with multi-level bottom electrode via contacts
IBM8 citations84
US10685879B1Jun 16, 2020
Lithographic alignment of a conductive line to a via
IBM8 citations84
US8383483B2Feb 26, 2013
High performance CMOS circuits, and methods for fabricating same
IBM10 citations84
US7781332B2Aug 24, 2010
Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer
IBM11 citations84
US10103022B2Oct 16, 2018
Alternating hardmasks for tight-pitch line formation
IBM8 citations83
US10957850B2Mar 23, 2021
Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication
IBM6 citations72
US10833258B1Nov 10, 2020
MRAM device formation with in-situ encapsulation
IBM3 citations72
US10580652B2Mar 3, 2020
Alternating hardmasks for tight-pitch line formation
IBM2 citations72
US7880241B2Feb 1, 2011
Low-temperature electrically activated gate electrode and method of fabricating same
IBM2 citations63
US7776695B2Aug 17, 2010
Semiconductor device structure having low and high performance devices of same conductive type on same substrate
IBM2 citations63
US11404317B2Aug 2, 2022
Method for fabricating a semiconductor device including self-aligned top via formation at line ends
IBM0 citations62
US11133260B2Sep 28, 2021
Self-aligned top via
IBM0 citations62
US12243771B2Mar 4, 2025
Selective patterning of vias with hardmasks
IBM0 citations60
US11276607B2Mar 15, 2022
Selective patterning of vias with hardmasks
IBM0 citations60
US10879068B2Dec 29, 2020
Extreme ultraviolet lithography for high volume manufacture of a semiconductor device
IBM0 citations52
US10304692B1May 28, 2019
Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuits
IBM0 citations52
US10242872B2Mar 26, 2019
Rework of patterned dielectric and metal hardmask films
IBM0 citations52
US10714683B2Jul 14, 2020
Multilayer hardmask for high performance MRAM devices
IBM0 citations51
US10680169B2Jun 9, 2020
Multilayer hardmask for high performance MRAM devices
IBM0 citations51
ARNOLD JOHN C
14 patentsUS8916337B2Dec 23, 2014
Dual hard mask lithography process
ARNOLD JOHN C21 citations92
US8298954B1Oct 30, 2012
Sidewall image transfer process employing a cap material layer for a metal nitride layer
ARNOLD JOHN C29 citations92
US8119531B1Feb 21, 2012
Mask and etch process for pattern assembly
ARNOLD JOHN C30 citations92
US8481423B2Jul 9, 2013
Methods to mitigate plasma damage in organosilicate dielectrics
ARNOLD JOHN C8 citations84
US8470711B2Jun 25, 2013
Tone inversion with partial underlayer etch for semiconductor device formation
ARNOLD JOHN C11 citations84
US8470706B2Jun 25, 2013
Methods to mitigate plasma damage in organosilicate dielectrics
ARNOLD JOHN C8 citations84
US8084329B2Dec 27, 2011
Transistor devices and methods of making
ARNOLD JOHN C8 citations84
US8129843B2Mar 6, 2012
Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer
ARNOLD JOHN C5 citations74
US8735283B2May 27, 2014
Method for forming small dimension openings in the organic masking layer of tri-layer lithography
ARNOLD JOHN C4 citations67
US8586482B2Nov 19, 2013
Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation
ARNOLD JOHN C4 citations63
US8580692B2Nov 12, 2013
Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation
ARNOLD JOHN C4 citations63
US8536031B2Sep 17, 2013
Method of fabricating dual damascene structures using a multilevel multiple exposure patterning scheme
ARNOLD JOHN C2 citations60
US8536630B2Sep 17, 2013
Transistor devices and methods of making
ARNOLD JOHN C0 citations52
US8448103B2May 21, 2013
Manufacturing features of different depth by placement of vias
ARNOLD JOHN C0 citations39
MOTOROLA INC
5 patentsUS5683548ANov 4, 1997
Inductively coupled plasma reactor and process
MOTOROLA INC158 citations97
US6500315B1Dec 31, 2002
Method and apparatus for forming a layer on a substrate
MOTOROLA INC15 citations92
US6139696AOct 31, 2000
Method and apparatus for forming a layer on a substrate
MOTOROLA INC18 citations92
US6165567ADec 26, 2000
Process of forming a semiconductor device
MOTOROLA INC28 citations90
US6054377AApr 25, 2000
Method for forming an inlaid via in a semiconductor device
MOTOROLA INC38 citations89