P

Inventor

ARNOLD JOHN C

US42 patents
⚠️ This page may combine multiple inventors who share the name “ARNOLD JOHN C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

20 patents
US10707413B1Jul 7, 2020

Formation of embedded magnetic random-access memory devices

IBM46 citations95
US10833257B1Nov 10, 2020

Formation of embedded magnetic random-access memory devices with multi-level bottom electrode via contacts

IBM8 citations84
US10685879B1Jun 16, 2020

Lithographic alignment of a conductive line to a via

IBM8 citations84
US8383483B2Feb 26, 2013

High performance CMOS circuits, and methods for fabricating same

IBM10 citations84
US7781332B2Aug 24, 2010

Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer

IBM11 citations84
US10103022B2Oct 16, 2018

Alternating hardmasks for tight-pitch line formation

IBM8 citations83
US10957850B2Mar 23, 2021

Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication

IBM6 citations72
US10833258B1Nov 10, 2020

MRAM device formation with in-situ encapsulation

IBM3 citations72
US10580652B2Mar 3, 2020

Alternating hardmasks for tight-pitch line formation

IBM2 citations72
US7880241B2Feb 1, 2011

Low-temperature electrically activated gate electrode and method of fabricating same

IBM2 citations63
US7776695B2Aug 17, 2010

Semiconductor device structure having low and high performance devices of same conductive type on same substrate

IBM2 citations63
US11404317B2Aug 2, 2022

Method for fabricating a semiconductor device including self-aligned top via formation at line ends

IBM0 citations62
US11133260B2Sep 28, 2021

Self-aligned top via

IBM0 citations62
US12243771B2Mar 4, 2025

Selective patterning of vias with hardmasks

IBM0 citations60
US11276607B2Mar 15, 2022

Selective patterning of vias with hardmasks

IBM0 citations60
US10879068B2Dec 29, 2020

Extreme ultraviolet lithography for high volume manufacture of a semiconductor device

IBM0 citations52
US10304692B1May 28, 2019

Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuits

IBM0 citations52
US10242872B2Mar 26, 2019

Rework of patterned dielectric and metal hardmask films

IBM0 citations52
US10714683B2Jul 14, 2020

Multilayer hardmask for high performance MRAM devices

IBM0 citations51
US10680169B2Jun 9, 2020

Multilayer hardmask for high performance MRAM devices

IBM0 citations51

ARNOLD JOHN C

14 patents
US8916337B2Dec 23, 2014

Dual hard mask lithography process

ARNOLD JOHN C21 citations92
US8298954B1Oct 30, 2012

Sidewall image transfer process employing a cap material layer for a metal nitride layer

ARNOLD JOHN C29 citations92
US8119531B1Feb 21, 2012

Mask and etch process for pattern assembly

ARNOLD JOHN C30 citations92
US8481423B2Jul 9, 2013

Methods to mitigate plasma damage in organosilicate dielectrics

ARNOLD JOHN C8 citations84
US8470711B2Jun 25, 2013

Tone inversion with partial underlayer etch for semiconductor device formation

ARNOLD JOHN C11 citations84
US8470706B2Jun 25, 2013

Methods to mitigate plasma damage in organosilicate dielectrics

ARNOLD JOHN C8 citations84
US8084329B2Dec 27, 2011

Transistor devices and methods of making

ARNOLD JOHN C8 citations84
US8129843B2Mar 6, 2012

Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer

ARNOLD JOHN C5 citations74
US8735283B2May 27, 2014

Method for forming small dimension openings in the organic masking layer of tri-layer lithography

ARNOLD JOHN C4 citations67
US8586482B2Nov 19, 2013

Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation

ARNOLD JOHN C4 citations63
US8580692B2Nov 12, 2013

Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation

ARNOLD JOHN C4 citations63
US8536031B2Sep 17, 2013

Method of fabricating dual damascene structures using a multilevel multiple exposure patterning scheme

ARNOLD JOHN C2 citations60
US8536630B2Sep 17, 2013

Transistor devices and methods of making

ARNOLD JOHN C0 citations52
US8448103B2May 21, 2013

Manufacturing features of different depth by placement of vias

ARNOLD JOHN C0 citations39

MOTOROLA INC

5 patents

YIN YUNPENG

1 patent

TESSERA INC

1 patent

GLOBALFOUNDRIES INC

1 patent