Inventor

BURNS SEAN D

US67 patents

⚠️ This page may combine multiple inventors who share the name “BURNS SEAN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BURNS SEAN D

IBM

Self aligned pattern formation post spacer etchback in tight pitch configurations

Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs

Silicon containing TARC/barrier layer

Self aligned pattern formation post spacer etchback in tight pitch configurations

Alternating hardmasks for tight-pitch line formation

Method and structure for cut material selection

Self aligned conductive lines with relaxed overlay

Antireflective composition and process of making a lithographic structure

Graded spin-on organic antireflective coating for photolithography

Selective gas etching for self-aligned pattern transfer

Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs

Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs

Multi-angled deposition and masking for custom spacer trim and selected spacer removal

Alternating hardmasks for tight-pitch line formation

Self aligned pattern formation post spacer etchback in tight pitch configurations

Self-aligned pattern formation for a semiconductor device

Self aligned conductive lines

Self aligned conductive lines

Aligning conductive vias with trenches

Graded spin-on organic antireflective coating for photolithography

Method for removing residues from a patterned substrate

Multiple exposure lithography method incorporating intermediate layer patterning

Low refractive index polymers as underlayers for silicon-containing photoresists

Low refractive index polymers as underlayers for silicon-containing photoresists

Self-aligned pattern formation for a semiconductor device

Self-aligned pattern formation for a semiconductor device

ARNOLD JOHN C

Dual hard mask lithography process

Sidewall image transfer process employing a cap material layer for a metal nitride layer

Mask and etch process for pattern assembly

Tone inversion with partial underlayer etch for semiconductor device formation

TESSERA INC

Alternating hardmasks for tight-pitch line formation

Self aligned pattern formation post spacer etchback in tight pitch configurations

Selective gas etching for self-aligned pattern transfer

Selective gas etching for self-aligned pattern transfer

TESSERA LLC

Self aligned pattern formation post spacer etchback in tight pitch configurations

Alternating hardmasks for tight-pitch line formation

Self aligned pattern formation post spacer etchback in tight pitch configurations

ARNOLD JOHN CHRISTOPHER

Self aligning via patterning

Self aligning via patterning

GOLDFARB DARIO L

Organic graded spin on BARC compositions for high NA lithography

Organic graded spin on BARC compositions for high NA lithography

ADEIA SEMICONDUCTOR SOLUTIONS LLC

Alternating hardmasks for tight-pitch line formation

Selective gas etching for self-aligned pattern transfer

BURNS SEAN D

Antireflective hardmask composition and a method of preparing a patterned material using same

Substrate planarization with imprint materials and processes

YIN YUNPENG

Sidewall image transfer process

RAGHUNATHAN SUDHARSHANAN

Sidewall image transfer process with multiple critical dimensions

ANGELOPOULOS MARIE

Process of making a lithographic structure using antireflective materials

BURKHARDT MARTIN

Process of multiple exposures with spin castable films

BERNARD DALSIN MFG COMPANY

Chimney cap