Inventor
ILLGEN RALF
DE24 patents
⚠️ This page may combine multiple inventors who share the name “ILLGEN RALF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
11 patentsUS9449972B1Sep 20, 2016
Ferroelectric FinFET
GLOBALFOUNDRIES INC7 citations84
US8835936B2Sep 16, 2014
Source and drain doping using doped raised source and drain regions
GLOBALFOUNDRIES INC11 citations84
US9899417B2Feb 20, 2018
Semiconductor structure including a first transistor and a second transistor
GLOBALFOUNDRIES INC4 citations73
US9583240B2Feb 28, 2017
Temperature independent resistor
GLOBALFOUNDRIES INC2 citations73
US8835255B2Sep 16, 2014
Method of forming a semiconductor structure including a vertical nanowire
GLOBALFOUNDRIES INC4 citations72
US10176859B2Jan 8, 2019
Non-volatile transistor element including a buried ferroelectric material based storage mechanism
GLOBALFOUNDRIES INC4 citations67
US10056376B2Aug 21, 2018
Ferroelectric FinFET
GLOBALFOUNDRIES INC1 citations52
US9966466B2May 8, 2018
Semiconductor-on-insulator wafer, semiconductor structure including a transistor, and methods for the formation and operation thereof
GLOBALFOUNDRIES INC0 citations52
US9685457B2Jun 20, 2017
Method including a formation of a transistor and semiconductor structure including a first transistor and a second transistor
GLOBALFOUNDRIES INC0 citations52
US8916928B2Dec 23, 2014
Threshold voltage adjustment in a fin transistor by corner implantation
GLOBALFOUNDRIES INC0 citations51
US9269714B2Feb 23, 2016
Device including a transistor having a stressed channel region and method for the formation thereof
GLOBALFOUNDRIES INC1 citations46
FLACHOWSKY STEFAN
6 patentsUS9224840B2Dec 29, 2015
Replacement gate FinFET structures with high mobility channel
FLACHOWSKY STEFAN27 citations92
US9012277B2Apr 21, 2015
In situ doping and diffusionless annealing of embedded stressor regions in PMOS and NMOS devices
FLACHOWSKY STEFAN8 citations84
US8536034B2Sep 17, 2013
Methods of forming stressed silicon-carbon areas in an NMOS transistor
FLACHOWSKY STEFAN5 citations73
US8753969B2Jun 17, 2014
Methods for fabricating MOS devices with stress memorization
FLACHOWSKY STEFAN3 citations62
US8647951B2Feb 11, 2014
Implantation of hydrogen to improve gate insulation layer-substrate interface
FLACHOWSKY STEFAN0 citations52
US8476131B2Jul 2, 2013
Methods of forming a semiconductor device with recessed source/design regions, and a semiconductor device comprising same
FLACHOWSKY STEFAN0 citations51
BALDAUF TIM
3 patentsUS8912606B2Dec 16, 2014
Integrated circuits having protruding source and drain regions and methods for forming integrated circuits
BALDAUF TIM16 citations81
US8580643B2Nov 12, 2013
Threshold voltage adjustment in a Fin transistor by corner implantation
BALDAUF TIM4 citations60
US8941187B2Jan 27, 2015
Strain engineering in three-dimensional transistors based on strained isolation material
BALDAUF TIM0 citations39