Inventor

FU JIANMING

US98 patents

⚠️ This page may combine multiple inventors who share the name “FU JIANMING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FU JIANMING

APPLIED MATERIALS INC

Methods and apparatus for forming barrier layers in high aspect ratio vias

Vault shaped target and magnetron operable in two sputtering modes

Sputtering target having an annular vault

Vault-shaped target and magnetron having both distributed and localized magnets

Pulsed sputtering with a small rotating magnetron

High-density plasma for ionized metal deposition capable of exciting a plasma wave

Magnetron and target producing an extended plasma region in a sputter reactor

Wafer bias ring in a sustained self-sputtering reactor

Sustained self-sputtering reactor having an increased density plasma

Plasma reactor and shields generating self-ionized plasma for sputtering

Biased shield in a magnetron sputter reactor

Integrated process for copper via filling using a magnetron and target producing highly energetic ions

Integrated process for copper via filling

Rotating sputter magnetron assembly

Process for sputtering copper in a self ionized plasma

Method for igniting a plasma in a sputter reactor

Apparatus for providing RF return current path control in a semiconductor wafer processing system

Oxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layers

Self-ionized and capacitively-coupled plasma for sputtering and resputtering

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

Multi-step magnetron sputtering process

Methods and apparatus for forming barrier layers in high aspect ratio vias

Method of depositing a TaN seed layer

Operating a magnetron sputter reactor in two modes

Sputtering of aligned magnetic materials and magnetic dipole ring used therefor

Auxiliary electromagnets in a magnetron sputter reactor

Method and apparatus for depositing a tantalum-containing layer on a substrate

Integrated copper fill process

Magnetron with a rotating center magnet for a vault shaped sputtering target

Sputter deposited barrier layers

Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source

Sputter target for eliminating redeposition on the target sidewall

Cover layer for a substrate support chuck and method of fabricating same

Electrically floating shield in a plasma reactor

Multi-step process for depositing copper seed layer in a via

Sputter magnetron having two rotation diameters

Self ionized sputtering using a high density plasma source

Multiple-step sputter deposition

Transverse magnetic field for ionized sputter deposition

Self ionized plasma sputtering

Sputtering method utilizing an extended plasma region

High-density plasma source for ionized metal deposition

Titanium nitride barrier layers

Wafer bias ring controlling the plasma potential in a sustained self-sputtering reactor

Ionized PVD source to produce uniform low-particle deposition

Reliable sustained self-sputtering

Titanium nitride barrier layers

Apparatus for sputtering magnetic target materials

Process for forming improved titanium-containing barrier layers

SILEVO INC

Module fabrication of solar cells with low resistivity electrodes