Inventor

YE JIAMING

CN19 patents

⚠️ This page may combine multiple inventors who share the name “YE JIAMING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YE JIAMING

SILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD

Multi-level leadframe with interconnect areas for soldering conductive bumps, multi-level package assembly and method for manufacturing the same

Package structure for power converter and manufacture method thereof

Package structure applied to power converter

Chip package structure and method for forming chip package

Package structure for power converter and manufacture method thereof

Chip package assembly and manufacturing method thereof

Integrated package assembly for switching regulator

Package assembly having interconnect for stacked electronic devices and method for manufacturing the same

Integrated package assembly for switching regulator

Package assembly and method for manufacturing the same

Chip package method and package assembly

Die attachment structure and method for manufacturing the same

Chip package structure and method for forming chip package

Package structure for power converter and manufacture method thereof

Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same

YE JIAMING

Interface device for bio-chip

Automatic injection device for microarray chip and automatic injection hybridization microarray chip

Biological chip hybridization system

CAPITALBIO CORP

Microfluidic devices for multi-index biochemical detection