Inventor
KUO TZ-JUN
TW15 patents
⚠️ This page may combine multiple inventors who share the name “KUO TZ-JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS9613856B1Apr 4, 2017
Method of forming metal interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD38 citations98
US9972529B2May 15, 2018
Method of forming metal interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD35 citations94
US10163786B2Dec 25, 2018
Method of forming metal interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9343356B2May 17, 2016
Back end of the line (BEOL) interconnect scheme
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations83
US9640431B2May 2, 2017
Method for via plating with seed layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10453740B2Oct 22, 2019
Interconnect structure without barrier layer on bottom surface of via
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US11715689B2Aug 1, 2023
Method of forming metal interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11551967B2Jan 10, 2023
Via structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9324608B2Apr 26, 2016
Method for via plating with seed layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12308282B2May 20, 2025
Interconnect structure without barrier layer on bottom surface of via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11322391B2May 3, 2022
Interconnect structure without barrier layer on bottom surface of via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10714424B2Jul 14, 2020
Method of forming metal interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9842767B2Dec 12, 2017
Method of forming an interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50