Inventor

YONG CHENG CHOI

MY5 patents

⚠️ This page may combine multiple inventors who share the name “YONG CHENG CHOI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

4 patents

US7160755B2Jan 9, 2007

Method of forming a substrateless semiconductor package

FREESCALE SEMICONDUCTOR INC58 citations94

US7626276B2Dec 1, 2009

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

FREESCALE SEMICONDUCTOR INC17 citations92

US6933614B2Aug 23, 2005

Integrated circuit die having a copper contact and method therefor

FREESCALE SEMICONDUCTOR INC31 citations91

US7241636B2Jul 10, 2007

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

FREESCALE SEMICONDUCTOR INC5 citations62

WONG BOH KID

1 patent

US9337167B2May 10, 2016

Wire bonding method employing two scrub settings

WONG BOH KID0 citations29