Inventor

HU LEJUN

US3 patents

⚠️ This page may combine multiple inventors who share the name “HU LEJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HU LEJUN

2 patents

US8441104B1May 14, 2013

Electrical overstress protection using through-silicon-via (TSV)

HU LEJUN52 citations94

US8525299B2Sep 3, 2013

Electrical overstress protection using through-silicon-via (TSV)

HU LEJUN3 citations59

COLN MICHAEL

1 patent

US9200968B2Dec 1, 2015

On-chip temperature sensor using interconnect metal

COLN MICHAEL3 citations59