Inventor
KANG MYUNGSUNG
KR4 patents
Patents
4 patentsUS11289438B2Mar 29, 2022
Die-to-wafer bonding structure and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD5 citations82
US11658141B2May 23, 2023
Die-to-wafer bonding structure and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US12394641B2Aug 19, 2025
Molding apparatus of semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12453087B2Oct 21, 2025
Semiconductor device having stacked semiconductor chips interconnected with support structures via TSV
SAMSUNG ELECTRONICS CO LTD0 citations47