P

Inventor

YE YI-LIANG

TW17 patents

Patents

17 patents
US10332981B1Jun 25, 2019

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP5 citations82
US10796943B2Oct 6, 2020

Manufacturing method of semiconductor structure

UNITED MICROELECTRONICS CORP2 citations72
US10312084B2Jun 4, 2019

Semiconductor device and fabrication method thereof

UNITED MICROELECTRONICS CORP3 citations72
US9960084B1May 1, 2018

Method for forming semiconductor device

UNITED MICROELECTRONICS CORP3 citations72
US9793105B1Oct 17, 2017

Fabricating method of fin field effect transistor (FinFET)

UNITED MICROELECTRONICS CORP2 citations72
US9748111B2Aug 29, 2017

Method of fabricating semiconductor structure using planarization process and cleaning process

UNITED MICROELECTRONICS CORP2 citations72
US9613808B1Apr 4, 2017

Method of forming multilayer hard mask with treatment for removing impurities and forming dangling bonds

UNITED MICROELECTRONICS CORP2 citations72
US10446667B2Oct 15, 2019

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP2 citations71
US10892348B2Jan 12, 2021

Method of rounding fin-shaped structure

UNITED MICROELECTRONICS CORP0 citations51
US10651174B2May 12, 2020

FinFET structure and fabricating method of gate structure

UNITED MICROELECTRONICS CORP0 citations51
US10622481B2Apr 14, 2020

Method of rounding corners of a fin

UNITED MICROELECTRONICS CORP0 citations51
US10340268B2Jul 2, 2019

FinFET structure and fabricating method of gate structure

UNITED MICROELECTRONICS CORP0 citations51
US9899520B2Feb 20, 2018

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP0 citations51
US9627534B1Apr 18, 2017

Semiconductor MOS device having a dense oxide film on a spacer

UNITED MICROELECTRONICS CORP1 citations51
US9570315B2Feb 14, 2017

Method of interfacial oxide layer formation in semiconductor device

UNITED MICROELECTRONICS CORP0 citations51
US10332741B2Jun 25, 2019

Method for post chemical mechanical polishing clean

UNITED MICROELECTRONICS CORP0 citations41
US9966266B2May 8, 2018

Apparatus for semiconductor wafer treatment and semiconductor wafer treatment

UNITED MICROELECTRONICS CORP0 citations41