Inventor
TIWARI RAJESH
IN17 patents
⚠️ This page may combine multiple inventors who share the name “TIWARI RAJESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ORACLE INT CORP
4 patentsUS11630708B2Apr 18, 2023
OSN/PCS collaboration mechanism integration
ORACLE INT CORP3 citations68
US11635974B2Apr 25, 2023
Providing a different configuration of added functionality for each of the stages of predeployment, deployment, and post deployment using a layer of abstraction
ORACLE INT CORP0 citations59
US11449348B2Sep 20, 2022
Pre/post deployment customization
ORACLE INT CORP0 citations59
US10521243B2Dec 31, 2019
Pre/post deployment customization
ORACLE INT CORP1 citations59
TEXAS INSTRUMENTS INC
4 patentsUS7010381B2Mar 7, 2006
Versatile system for controlling semiconductor topography
TEXAS INSTRUMENTS INC4 citations61
US6941242B2Sep 6, 2005
Versatile system for variance-based data analysis
TEXAS INSTRUMENTS INC2 citations61
US6709974B2Mar 23, 2004
Method of preventing seam defects in isolated lines
TEXAS INSTRUMENTS INC4 citations56
US7387960B2Jun 17, 2008
Dual depth trench termination method for improving Cu-based interconnect integrity
TEXAS INSTRUMENTS INC2 citations53
MOTOROLA INC
3 patentsUS6444569B2Sep 3, 2002
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC60 citations95
US6274478B1Aug 14, 2001
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC70 citations95
US6573173B2Jun 3, 2003
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
MOTOROLA INC23 citations91