Inventor

DJUKIC MILAN

US3 patents

Patents

3 patents

US7323360B2Jan 29, 2008

Electronic assemblies with filled no-flow underfill

INTEL CORP32 citations90

US6703299B2Mar 9, 2004

Underfill process for flip-chip device

INTEL CORP19 citations90

US7498678B2Mar 3, 2009

Electronic assemblies and systems with filled no-flow underfill

INTEL CORP9 citations82