Inventor

BOYAUD MARIE-FRANCE

CA3 patents

Patents

3 patents

US6988882B2Jan 24, 2006

Transfer molding of integrated circuit packages

IBM7 citations70

US6956296B2Oct 18, 2005

Transfer molding of integrated circuit packages

IBM9 citations70

US6656773B2Dec 2, 2003

Transfer molding of integrated circuit packages

IBM9 citations70