Inventor
HUNG LIANG-YI
TW9 patents
⚠️ This page may combine multiple inventors who share the name “HUNG LIANG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
4 patentsUS9607923B2Mar 28, 2017
Electronic device having a thermal conductor made of silver between a heat sink and an electronic element, and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations63
US9112063B2Aug 18, 2015
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US10096491B2Oct 9, 2018
Method of fabricating a packaging substrate including a carrier having two carrying portions
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40
US9542598B2Jan 10, 2017
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40