Inventor

KWON CHILWOO

KR3 patents

Patents

3 patents

US11264339B2Mar 1, 2022

Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations55

US10985091B2Apr 20, 2021

Semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations50

US11728283B2Aug 15, 2023

Package substrate and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations45