Inventor
GOCHNOUR DEREK J
US49 patents
⚠️ This page may combine multiple inventors who share the name “GOCHNOUR DEREK J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
48 patentsUS6578458B1Jun 17, 2003
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC106 citations99
US6247629B1Jun 19, 2001
Wire bond monitoring system for layered packages
MICRON TECHNOLOGY INC144 citations99
US6555400B2Apr 29, 2003
Method for substrate mapping
MICRON TECHNOLOGY INC38 citations96
US6553276B2Apr 22, 2003
Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
MICRON TECHNOLOGY INC48 citations96
US6427676B2Aug 6, 2002
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC24 citations96
US6401580B1Jun 11, 2002
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC20 citations96
US6369595B1Apr 9, 2002
CSP BGA test socket with insert and method
MICRON TECHNOLOGY INC55 citations96
US6363295B1Mar 26, 2002
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
MICRON TECHNOLOGY INC64 citations96
US6250192B1Jun 26, 2001
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC29 citations96
US6224936B1May 1, 2001
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC47 citations96
US6196096B1Mar 6, 2001
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC18 citations96
US6155247ADec 5, 2000
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC27 citations96
US6119675ASep 19, 2000
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC38 citations96
US6006739ADec 28, 1999
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC52 citations96
US5907492AMay 25, 1999
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
MICRON TECHNOLOGY INC81 citations96
US7155300B2Dec 26, 2006
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
MICRON TECHNOLOGY INC25 citations93
US7120513B1Oct 10, 2006
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
MICRON TECHNOLOGY INC26 citations93
US6888159B2May 3, 2005
Substrate mapping
MICRON TECHNOLOGY INC15 citations93
US6710612B2Mar 23, 2004
CSP BGA test socket with insert and method
MICRON TECHNOLOGY INC20 citations93
US6691696B2Feb 17, 2004
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC17 citations93
US6592670B1Jul 15, 2003
Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC15 citations93
US6527999B2Mar 4, 2003
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC13 citations93
US6441628B1Aug 27, 2002
CSP BGA test socket with insert and method
MICRON TECHNOLOGY INC20 citations93
US6180527B1Jan 30, 2001
Method and apparatus for thinning article, and article
MICRON TECHNOLOGY INC30 citations93
US5342807AAug 30, 1994
Soft bond for semiconductor dies
MICRON TECHNOLOGY INC24 citations93
US5336649AAug 9, 1994
Removable adhesives for attachment of semiconductor dies
MICRON TECHNOLOGY INC37 citations93
US5173451ADec 22, 1992
Soft bond for semiconductor dies
MICRON TECHNOLOGY INC55 citations93
US6970359B2Nov 29, 2005
Reduced-sized memory card package, length-extending adaptor and method of forming adaptor
MICRON TECHNOLOGY INC38 citations92
US6865086B2Mar 8, 2005
Apparatus and method to secure an adaptor to a reduced-sized memory card
MICRON TECHNOLOGY INC41 citations92
US6085962AJul 11, 2000
Wire bond monitoring system for layered packages
MICRON TECHNOLOGY INC29 citations92
US6687990B2Feb 10, 2004
Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby
MICRON TECHNOLOGY INC13 citations84
US6830719B2Dec 14, 2004
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC11 citations82
US7561938B2Jul 14, 2009
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs
MICRON TECHNOLOGY INC7 citations74
US7166252B2Jan 23, 2007
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC8 citations74
US6932077B2Aug 23, 2005
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus
MICRON TECHNOLOGY INC5 citations74
US6897571B2May 24, 2005
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC2 citations74
US6808947B2Oct 26, 2004
Substrate mapping
MICRON TECHNOLOGY INC9 citations74
US6764549B2Jul 20, 2004
Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC9 citations74
US6631662B2Oct 14, 2003
Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC5 citations74
US6630836B2Oct 7, 2003
CSP BGA test socket with insert
MICRON TECHNOLOGY INC4 citations74
US6628128B1Sep 30, 2003
CSP BGA test socket with insert and method
MICRON TECHNOLOGY INC7 citations74
US6459105B2Oct 1, 2002
Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC4 citations74
US6423616B2Jul 23, 2002
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC2 citations74
US6255196B1Jul 3, 2001
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC5 citations74
US7387119B2Jun 17, 2008
Dicing saw with variable indexing capability
MICRON TECHNOLOGY INC0 citations63
US7022533B2Apr 4, 2006
Substrate mapping
MICRON TECHNOLOGY INC2 citations63
US6841796B2Jan 11, 2005
Substrate mapping
MICRON TECHNOLOGY INC1 citations63
US6279563B1Aug 28, 2001
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
MICRON TECHNOLOGY INC1 citations63