Inventor

BACKER HEIKO

DE2 patents

⚠️ This page may combine multiple inventors who share the name “BACKER HEIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NXP BV

1 patent

US9349645B2May 24, 2016

Apparatus, device and method for wafer dicing

NXP BV0 citations48

PHILIPS CORP

1 patent

US5878941AMar 9, 1999

Method of soldering components on a carrier foil

PHILIPS CORP4 citations48