Inventor
BROOKS JERRY M
US165 patents
Patents
50 patentsUS7262506B2Aug 28, 2007
Stacked mass storage flash memory package
MICRON TECHNOLOGY INC85 citations99
US6900528B2May 31, 2005
Stacked mass storage flash memory package
MICRON TECHNOLOGY INC229 citations99
US6583503B2Jun 24, 2003
Semiconductor package with stacked substrates and multiple semiconductor dice
MICRON TECHNOLOGY INC275 citations99
US6429528B1Aug 6, 2002
Multichip semiconductor package
MICRON TECHNOLOGY INC194 citations99
US6344976B1Feb 5, 2002
Interdigitated leads-over-chip lead frame device and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC202 citations99
US6326244B1Dec 4, 2001
Method of making a cavity ball grid array apparatus
MICRON TECHNOLOGY INC376 citations99
US6284571B1Sep 4, 2001
Lead frame assemblies with voltage reference plane and IC packages including same
MICRON TECHNOLOGY INC190 citations99
US6258623B1Jul 10, 2001
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC354 citations99
US6225689B1May 1, 2001
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC295 citations99
US6222265B1Apr 24, 2001
Method of constructing stacked packages
MICRON TECHNOLOGY INC201 citations99
US6159764ADec 12, 2000
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
MICRON TECHNOLOGY INC283 citations99
US6148509ANov 21, 2000
Method for supporting an integrated circuit die
MICRON TECHNOLOGY INC221 citations99
US6084297AJul 4, 2000
Cavity ball grid array apparatus
MICRON TECHNOLOGY INC319 citations99
US6072233AJun 6, 2000
Stackable ball grid array package
MICRON TECHNOLOGY INC579 citations99
US6051878AApr 18, 2000
Method of constructing stacked packages
MICRON TECHNOLOGY INC422 citations99
US5994166ANov 30, 1999
Method of constructing stacked packages
MICRON TECHNOLOGY INC339 citations99
US5973935AOct 26, 1999
Interdigitated leads-over-chip lead frame for supporting an integrated circuit die
MICRON TECHNOLOGY INC202 citations99
US5677566AOct 14, 1997
Semiconductor chip package
MICRON TECHNOLOGY INC550 citations99
US7061092B2Jun 13, 2006
High-density modularity for ICS
MICRON TECHNOLOGY INC76 citations98
US6965160B2Nov 15, 2005
Semiconductor dice packages employing at least one redistribution layer
MICRON TECHNOLOGY INC102 citations98
US6140154AOct 31, 2000
Multi-part lead frame with dissimilar materials and method of manufacturing
MICRON TECHNOLOGY INC152 citations98
US6072228AJun 6, 2000
Multi-part lead frame with dissimilar materials and method of manufacturing
MICRON TECHNOLOGY INC201 citations98
US5140405AAug 18, 1992
Semiconductor assembly utilizing elastomeric single axis conductive interconnect
MICRON TECHNOLOGY INC181 citations98
US5440241AAug 8, 1995
Method for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced thereby
MICRON TECHNOLOGY INC118 citations97
US7704794B2Apr 27, 2010
Method of forming a semiconductor device
MICRON TECHNOLOGY INC43 citations96
US6979596B2Dec 27, 2005
Method of fabricating a tape having apertures under a lead frame for conventional IC packages
MICRON TECHNOLOGY INC27 citations96
US6979895B2Dec 27, 2005
Semiconductor assembly of stacked substrates and multiple semiconductor dice
MICRON TECHNOLOGY INC58 citations96
US6897096B2May 24, 2005
Method of packaging semiconductor dice employing at least one redistribution layer
MICRON TECHNOLOGY INC64 citations96
US6815251B1Nov 9, 2004
High density modularity for IC's
MICRON TECHNOLOGY INC54 citations96
US6686655B2Feb 3, 2004
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC45 citations96
US6656767B1Dec 2, 2003
Method of forming a stack of packaged memory dice
MICRON TECHNOLOGY INC41 citations96
US6531339B2Mar 11, 2003
Redundancy mapping in a multichip semiconductor package
MICRON TECHNOLOGY INC62 citations96
US6486546B2Nov 26, 2002
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC47 citations96
US6455928B2Sep 24, 2002
Stackable ball grid array package
MICRON TECHNOLOGY INC41 citations96
US6445063B1Sep 3, 2002
Method of forming a stack of packaged memory die and resulting apparatus
MICRON TECHNOLOGY INC24 citations96
US6404044B2Jun 11, 2002
Semiconductor package with stacked substrates and multiple semiconductor dice
MICRON TECHNOLOGY INC64 citations96
US6331939B1Dec 18, 2001
Stackable ball grid array package
MICRON TECHNOLOGY INC47 citations96
US6268649B1Jul 31, 2001
Stackable ball grid array package
MICRON TECHNOLOGY INC73 citations96
US6215177B1Apr 10, 2001
Tape under frame for conventional-type IC package assembly
MICRON TECHNOLOGY INC49 citations96
US6207474B1Mar 27, 2001
Method of forming a stack of packaged memory die and resulting apparatus
MICRON TECHNOLOGY INC56 citations96
US6153929ANov 28, 2000
Low profile multi-IC package connector
MICRON TECHNOLOGY INC46 citations96
US5903443AMay 11, 1999
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC33 citations96
US5729049AMar 17, 1998
Tape under frame for conventional-type IC package assembly
MICRON TECHNOLOGY INC60 citations96
US5616953AApr 1, 1997
Lead frame surface finish enhancement
MICRON TECHNOLOGY INC88 citations96
US5150194ASep 22, 1992
Anti-bow zip lead frame design
MICRON TECHNOLOGY INC62 citations96
US6228548B1May 8, 2001
Method of making a multichip semiconductor package
MICRON TECHNOLOGY INC284 citations95
US7375419B2May 20, 2008
Stacked mass storage flash memory package
MICRON TECHNOLOGY INC19 citations93
US7084514B2Aug 1, 2006
Multi-chip module and methods
MICRON TECHNOLOGY INC13 citations93
US6979904B2Dec 27, 2005
Integrated circuit package having reduced interconnects
MICRON TECHNOLOGY INC14 citations93
US6897553B2May 24, 2005
Apparatus for forming a stack of packaged memory dice
MICRON TECHNOLOGY INC16 citations93
Showing the top 50 of 165 patents by PatentIndex Score.