Inventor

SCHWAB MATT E

US38 patents

⚠️ This page may combine multiple inventors who share the name “SCHWAB MATT E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHWAB MATT E

MICRON TECHNOLOGY INC

Method of making a semiconductor device having an opening in a solder mask

Multi-chip module and methods

Multi-chip module and methods

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices

Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods

Packaged microdevices and methods for manufacturing packaged microdevices

Packaged microdevices and methods for manufacturing packaged microdevices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial

Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element

Multi-chip module and methods

Method of making a semiconductor device having an opening in a solder mask

Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices

Solder resist opening to define a combination pin one indicator and fiducial

Method of fabricating a semiconductor device package

Methods for fabricating routing elements for multichip modules

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Integrated circuit device having reduced bow and method for making same

Method for making an integrated circuit package having reduced bow

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Routing element for use in semiconductor device assemblies

Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element

Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices

Integrated circuit device having reduced bow and method for making same

Packaged semiconductor components having substantially rigid support members

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Packaged microdevices and methods for manufacturing packaged microdevices

Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods

Integrated circuit device having reduced bow and method for making same

Method of making a semiconductor device having an opening in a solder mask

ROUND ROCK RES LLC

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices

Multi-chip module and methods

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices

SCHWAB MATT E

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices