Inventor
REYNOLDS TRACY V
US19 patents
⚠️ This page may combine multiple inventors who share the name “REYNOLDS TRACY V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
16 patentsUS7423336B2Sep 9, 2008
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
MICRON TECHNOLOGY INC14 citations92
US6882034B2Apr 19, 2005
Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
MICRON TECHNOLOGY INC15 citations92
US8354301B2Jan 15, 2013
Packaged microdevices and methods for manufacturing packaged microdevices
MICRON TECHNOLOGY INC7 citations84
US7868440B2Jan 11, 2011
Packaged microdevices and methods for manufacturing packaged microdevices
MICRON TECHNOLOGY INC11 citations84
US6987325B2Jan 17, 2006
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
MICRON TECHNOLOGY INC10 citations82
US7094631B2Aug 22, 2006
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
MICRON TECHNOLOGY INC4 citations74
US6995043B2Feb 7, 2006
Methods for fabricating routing elements for multichip modules
MICRON TECHNOLOGY INC8 citations74
US10256214B2Apr 9, 2019
Computer modules with small thicknesses and associated methods of manufacturing
MICRON TECHNOLOGY INC2 citations73
US7372131B2May 13, 2008
Routing element for use in semiconductor device assemblies
MICRON TECHNOLOGY INC1 citations63
US7282397B2Oct 16, 2007
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
MICRON TECHNOLOGY INC2 citations63
US7282805B2Oct 16, 2007
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
MICRON TECHNOLOGY INC2 citations63
US10522515B2Dec 31, 2019
Computer modules with small thicknesses and associated methods of manufacturing
MICRON TECHNOLOGY INC0 citations52
US9717157B2Jul 25, 2017
Computer modules with small thicknesses and associated methods of manufacturing
MICRON TECHNOLOGY INC0 citations52
US8987885B2Mar 24, 2015
Packaged microdevices and methods for manufacturing packaged microdevices
MICRON TECHNOLOGY INC0 citations52
US8959759B2Feb 24, 2015
Method for assembling computer modules small in thickness
MICRON TECHNOLOGY INC0 citations52
US7372138B2May 13, 2008
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods
MICRON TECHNOLOGY INC0 citations52
ROUND ROCK RES LLC
2 patentsUS7851922B2Dec 14, 2010
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
ROUND ROCK RES LLC5 citations74
US7944057B2May 17, 2011
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
ROUND ROCK RES LLC1 citations63