Inventor

CHOU MARK

US7 patents

⚠️ This page may combine multiple inventors who share the name “CHOU MARK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEGICA CORP

2 patents

US7470997B2Dec 30, 2008

Wirebond pad for semiconductor chip or wafer

MEGICA CORP66 citations97

US7554208B2Jun 30, 2009

Wirebond pad for semiconductor chip or wafer

MEGICA CORP1 citations52

BLACK & DECKER INC

2 patents

US10537983B2Jan 21, 2020

Modular power tool

BLACK & DECKER INC10 citations79

US10420287B2Sep 24, 2019

Pole assembly for vegetation cutting tool

BLACK & DECKER INC5 citations66

LIN MOU-SHIUNG

1 patent

US8187965B2May 29, 2012

Wirebond pad for semiconductor chip or wafer

LIN MOU-SHIUNG20 citations92

Liu xiao-jun

1 patent

US8529136B2Sep 10, 2013

High temperature ball bearing

Liu xiao-jun6 citations59

ACT RX TECHNOLOGY CORP

1 patent

US6840677B2Jan 11, 2005

Ceramic bearing structure

ACT RX TECHNOLOGY CORP2 citations48