Inventor

HUANG FON SHAN

TW2 patents

⚠️ This page may combine multiple inventors who share the name “HUANG FON SHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IND TECH RES INST

1 patent

US6511609B2Jan 28, 2003

Cu seed layer deposition for ULSI metalization

IND TECH RES INST4 citations54

UNIV TSINGHUA

1 patent

US7214611B2May 8, 2007

Imprinting-damascene process for metal interconnection

UNIV TSINGHUA4 citations51