Inventor
LAU KENG KIAT
SG4 patents
Patents
4 patentsUS7683461B2Mar 23, 2010
Integrated circuit leadless package system
STATS CHIPPAC LTD31 citations88
US7298026B2Nov 20, 2007
Large die package and method for the fabrication thereof
STATS CHIPPAC LTD13 citations83
US7338841B2Mar 4, 2008
Leadframe with encapsulant guide and method for the fabrication thereof
STATS CHIPPAC LTD13 citations80
US7947534B2May 24, 2011
Integrated circuit packaging system including a non-leaded package
STATS CHIPPAC LTD3 citations62