Inventor

LEU JIHPERNG

US29 patents

⚠️ This page may combine multiple inventors who share the name “LEU JIHPERNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEU JIHPERNG

INTEL CORP

Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics

Method of making semiconductor device using an interconnect

Method for making a dual damascene interconnect using a multilayer hard mask

Method of forming a selectively converted inter-layer dielectric using a porogen material

Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material

Mechanically robust interconnect for low-k dielectric material using post treatment

Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide

Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects

Method of making semiconductor device using a novel interconnect cladding layer

Selectively converted inter-layer dielectric

Semiconductor device having a region of a material which is vaporized upon exposing to ultraviolet radiation

Method of forming an air gap within a structure by exposing an ultraviolet sensitive material to ultraviolet radiation

Low-K dielectric structure and method

Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide

Method of making a semiconductor device by forming a masking layer with a tapered etch profile

Metal-metal oxide etch stop/barrier for integrated circuit interconnects

Dual-damascene interconnects without an etch stop layer by alternating ILDs

Low-k dielectric film with good mechanical strength

Bonding a metal component to a low-k dielectric material

Semiconductor device using an interconnect

Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement

Dielectric material treatment

Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer

Mechanically robust dielectric film and stack

Selectively converted inter-layer dielectric

Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate—therein

Mechanically robust interconnect for low-k dielectric material using post treatment

MORROW XIAORONG

Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects

LEU JIHPERNG

Electroluminescent device including moisture barrier layer