Inventor
YAMAGUCHI YOSHIHIDE
JP34 patents
⚠️ This page may combine multiple inventors who share the name “YAMAGUCHI YOSHIHIDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS TECH CORP
12 patentsUS6861742B2Mar 1, 2005
Wafer level chip size package having rerouting layers
RENESAS TECH CORP64 citations96
US6720591B2Apr 13, 2004
Semiconductor integrated circuit device
RENESAS TECH CORP16 citations93
US6930388B2Aug 16, 2005
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
RENESAS TECH CORP37 citations92
US6822317B1Nov 23, 2004
Semiconductor apparatus including insulating layer having a protrusive portion
RENESAS TECH CORP37 citations92
US6770547B1Aug 3, 2004
Method for producing a semiconductor device
RENESAS TECH CORP40 citations92
US6946723B2Sep 20, 2005
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP13 citations84
US7002250B2Feb 21, 2006
Semiconductor module
RENESAS TECH CORP14 citations81
US7084498B2Aug 1, 2006
Semiconductor device having projected electrodes and structure for mounting the same
RENESAS TECH CORP9 citations74
US6949416B2Sep 27, 2005
Method of manufacturing a semiconductor integrated circuit device
RENESAS TECH CORP9 citations74
US6946327B2Sep 20, 2005
Semiconductor device and manufacturing method of that
RENESAS TECH CORP2 citations63
US6998713B2Feb 14, 2006
Wiring board and method for producing same
RENESAS TECH CORP3 citations60
US7378333B2May 27, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP0 citations52
HITACHI LTD
10 patentsUS6791178B2Sep 14, 2004
Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices
HITACHI LTD77 citations98
US6780748B2Aug 24, 2004
Method of fabricating a wafer level chip size package utilizing a maskless exposure
HITACHI LTD150 citations98
US6610934B2Aug 26, 2003
Semiconductor module and method of making the device
HITACHI LTD67 citations96
US6515372B1Feb 4, 2003
Wiring board and its production method, semiconductor device and its production method, and electronic apparatus
HITACHI LTD44 citations94
US7057283B2Jun 6, 2006
Semiconductor device and method for producing the same
HITACHI LTD26 citations92
US6695200B2Feb 24, 2004
Method of producing electronic part with bumps and method of producing electronic part
HITACHI LTD16 citations92
US6624504B1Sep 23, 2003
Semiconductor device and method for manufacturing the same
HITACHI LTD43 citations92
US6595404B2Jul 22, 2003
Method of producing electronic part with bumps and method of producing electronic part
HITACHI LTD18 citations92
US5480048AJan 2, 1996
Multilayer wiring board fabricating method
HITACHI LTD49 citations90
US6756688B2Jun 29, 2004
Wiring board and its production method, semiconductor device and its production method, and electronic apparatus
HITACHI LTD8 citations71
HITACHI HIGH TECH CORP
6 patentsUS11515169B2Nov 29, 2022
Method of making a semiconductor device including etching of a metal silicate using sequential and cyclic application of reactive gases
HITACHI HIGH TECH CORP2 citations73
US10460953B2Oct 29, 2019
Semiconductor manufacturing apparatus for manufacturing a semiconductor device having a high-K insulating film, and a method for manufacturing the semiconductor device
HITACHI HIGH TECH CORP2 citations73
US11380523B2Jul 5, 2022
Semiconductor manufacturing apparatus
HITACHI HIGH TECH CORP2 citations72
US11515167B2Nov 29, 2022
Plasma etching method and plasma processing apparatus
HITACHI HIGH TECH CORP1 citations62
US10910230B2Feb 2, 2021
Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
HITACHI HIGH TECH CORP0 citations62
US11915939B2Feb 27, 2024
Semiconductor fabricating method
HITACHI HIGH TECH CORP0 citations51
HITACHI VIA MECHANICS LTD
2 patentsUS7839484B2Nov 23, 2010
Exposure apparatus and exposure method, and method of manufacturing electrical wiring board
HITACHI VIA MECHANICS LTD5 citations63
US7760328B2Jul 20, 2010
Exposure apparatus and exposing method and method of manufacturing a printed wiring board
HITACHI VIA MECHANICS LTD0 citations42