Inventor
ISHIMATSU TOMOYUKI
JP34 patents
⚠️ This page may combine multiple inventors who share the name “ISHIMATSU TOMOYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DEXERIALS CORP
16 patentsUS10350872B2Jul 16, 2019
Method for manufacturing anisotropically conductive film, anisotropically conductive film, and conductive structure
DEXERIALS CORP3 citations73
US10199358B2Feb 5, 2019
Multilayer substrate
DEXERIALS CORP3 citations73
US9741598B2Aug 22, 2017
Protective tape and method for manufacturing a semiconductor device using the same
DEXERIALS CORP3 citations68
US10943879B2Mar 9, 2021
Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure
DEXERIALS CORP0 citations62
US10589502B2Mar 17, 2020
Anisotropic conductive film, connected structure, and method for manufacturing a connected structure
DEXERIALS CORP1 citations62
US11402408B2Aug 2, 2022
Electrical characteristics inspection tool
DEXERIALS CORP0 citations57
US10312125B2Jun 4, 2019
Protective tape and method for manufacturing semiconductor device using the same
DEXERIALS CORP1 citations56
US10442958B2Oct 15, 2019
Anisotropic conductive film and production method of the same
DEXERIALS CORP0 citations52
US9924599B2Mar 20, 2018
Anisotropic conductive film, anisotropic conductive film production method, connecting method, and bonded structure
DEXERIALS CORP0 citations52
US11901325B2Feb 13, 2024
Multilayer substrate
DEXERIALS CORP0 citations51
US10832830B2Nov 10, 2020
Anisotropic electrically conductive film, method for producing same, and connection structural body
DEXERIALS CORP0 citations51
US10566108B2Feb 18, 2020
Anisotropic electrically conductive film, method for producing same, and connection structural body
DEXERIALS CORP0 citations51
US10304587B2May 28, 2019
Anisotropic electrically conductive film, method for producing same, and connection structural body
DEXERIALS CORP0 citations51
US11624011B2Apr 11, 2023
Thermosetting adhesive sheet and semiconductor device manufacturing method
DEXERIALS CORP0 citations47
US10273386B2Apr 30, 2019
Thermosetting adhesive sheet and semiconductor device manufacturing method
DEXERIALS CORP0 citations47
US10575410B2Feb 25, 2020
Anisotropic conductive film, manufacturing method thereof, and connection structure
DEXERIALS CORP0 citations41
ISHIMATSU TOMOYUKI
9 patentsUS8395052B2Mar 12, 2013
Conductive particle, anisotropic conductive film, joined structure, and joining method
ISHIMATSU TOMOYUKI8 citations78
US8796557B2Aug 5, 2014
Adhesive film, connecting method, and joined structure
ISHIMATSU TOMOYUKI5 citations70
US8932716B2Jan 13, 2015
Conductive particle, and anisotropic conductive film, bonded structure, and bonding method
ISHIMATSU TOMOYUKI3 citations62
US8309638B2Nov 13, 2012
Connecting film, and joined structure and method for producing the same
ISHIMATSU TOMOYUKI2 citations62
US8247697B2Aug 21, 2012
Anisotropic conductive film, joined structure and method for producing the joined structure
ISHIMATSU TOMOYUKI2 citations62
US8273207B2Sep 25, 2012
Method for connecting electronic part and joined structure
ISHIMATSU TOMOYUKI3 citations61
US8980043B2Mar 17, 2015
Anisotropic conductive film, joined structure and method for producing the joined structure
ISHIMATSU TOMOYUKI0 citations51
US8330052B2Dec 11, 2012
Joined structure and method for producing the same
ISHIMATSU TOMOYUKI0 citations41
US8158887B2Apr 17, 2012
Adhesive film, connecting method, and joined structure
ISHIMATSU TOMOYUKI0 citations39
SONY CHEMICALS CORP
4 patentsUS6344156B1Feb 5, 2002
Anisotropic conductive adhesive film
SONY CHEMICALS CORP63 citations94
US6527984B1Mar 4, 2003
Low temperature-curable connecting material for anisotropically electroconductive connection
SONY CHEMICALS CORP13 citations84
US6827880B2Dec 7, 2004
Anisotropic conductive adhesive
SONY CHEMICALS CORP12 citations73
US6777478B2Aug 17, 2004
Adhesive material
SONY CHEMICALS CORP0 citations52