Inventor
WAKABAYASHI YUKI
JP43 patents
⚠️ This page may combine multiple inventors who share the name “WAKABAYASHI YUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MURATA MANUFACTURING CO
24 patentsUS9019048B1Apr 28, 2015
High-frequency signal transmission line and electronic device
MURATA MANUFACTURING CO8 citations83
US10867747B2Dec 15, 2020
Electronic device
MURATA MANUFACTURING CO1 citations73
US10056669B2Aug 21, 2018
Transmission line
MURATA MANUFACTURING CO3 citations73
US9672970B2Jun 6, 2017
Inductor bridge and electronic device
MURATA MANUFACTURING CO4 citations73
US9666352B2May 30, 2017
Inductor bridge and electronic device
MURATA MANUFACTURING CO2 citations73
US9462678B2Oct 4, 2016
High-frequency signal transmission line and electronic device
MURATA MANUFACTURING CO4 citations73
US9167685B2Oct 20, 2015
Circuit board
MURATA MANUFACTURING CO6 citations73
US9854685B2Dec 26, 2017
Electronic component, method for manufacturing the electronic component, and circuit board
MURATA MANUFACTURING CO4 citations72
US9627735B2Apr 18, 2017
High-frequency signal line and electronic device provided with the same
MURATA MANUFACTURING CO2 citations72
US9974185B2May 15, 2018
Component-embedded substrate
MURATA MANUFACTURING CO2 citations71
US9484612B2Nov 1, 2016
High-frequency signal line and electronic device including the same
MURATA MANUFACTURING CO2 citations63
US10128040B2Nov 13, 2018
Inductor bridge and electronic device
MURATA MANUFACTURING CO1 citations62
US10424432B2Sep 24, 2019
Inductor bridge and electronic device
MURATA MANUFACTURING CO0 citations52
US10158157B2Dec 18, 2018
High-frequency signal line and manufacturing method thereof
MURATA MANUFACTURING CO0 citations52
US9774070B2Sep 26, 2017
High-frequency signal line and manufacturing method thereof
MURATA MANUFACTURING CO0 citations52
US9607260B2Mar 28, 2017
Antenna device and communication apparatus
MURATA MANUFACTURING CO1 citations52
US9986139B2May 29, 2018
Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same
MURATA MANUFACTURING CO0 citations51
US9922918B2Mar 20, 2018
Substrate for stacked module, stacked module, and method for manufacturing stacked module
MURATA MANUFACTURING CO0 citations51
US9813595B2Nov 7, 2017
Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same
MURATA MANUFACTURING CO0 citations51
US9699908B2Jul 4, 2017
Component-embedded board and communication terminal device
MURATA MANUFACTURING CO0 citations42
US9437559B2Sep 6, 2016
High-frequency module
MURATA MANUFACTURING CO0 citations42
US10231342B2Mar 12, 2019
Component built-in substrate
MURATA MANUFACTURING CO0 citations40
US9629249B2Apr 18, 2017
Component-embedded substrate and communication module
MURATA MANUFACTURING CO0 citations40
US9730322B2Aug 8, 2017
Production method of component-embedded substrate, and component-embedded substrate
MURATA MANUFACTURING CO0 citations37
KAO CORP
10 patentsUS10655030B2May 19, 2020
Water-based ink
KAO CORP2 citations72
US9670374B2Jun 6, 2017
Water-based ink for inkjet printing
KAO CORP3 citations70
US10584252B2Mar 10, 2020
Inkjet printing method and water-based ink
KAO CORP1 citations62
US10266712B2Apr 23, 2019
Ink-jet printing with water-based ink on recording medium have low water-absorption
KAO CORP1 citations61
US11899396B2Feb 13, 2024
Toner for development of electrostatic images
KAO CORP0 citations55
US11841678B2Dec 12, 2023
Toner production method
KAO CORP0 citations52
US11768446B2Sep 26, 2023
Toner production method
KAO CORP0 citations52
US8349943B2Jan 8, 2013
Pigment dispersant containing a copolymer with constituent units derived from polymerizable macromonomers
KAO CORP1 citations51
US10465083B2Nov 5, 2019
Inkjet printing method and water-based ink
KAO CORP0 citations41
US9447298B2Sep 20, 2016
Ink-jet printing method
KAO CORP0 citations37