Inventor
LIAO CHIA-LIANG
TW7 patents
Patents
7 patentsUS10795255B2Oct 6, 2020
Method of forming layout definition of semiconductor device
UNITED MICROELECTRONICS CORP2 citations72
US11670567B2Jun 6, 2023
Semiconductor structure and method of wafer bonding
UNITED MICROELECTRONICS CORP2 citations70
US12278210B2Apr 15, 2025
Manufacturing method of semiconductor structure
UNITED MICROELECTRONICS CORP0 citations61
US10658366B2May 19, 2020
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP1 citations61
US12080622B2Sep 3, 2024
Semiconductor structure and method of wafer bonding
UNITED MICROELECTRONICS CORP0 citations59
US10535610B2Jan 14, 2020
Semiconductor structure
UNITED MICROELECTRONICS CORP0 citations51
US12300534B2May 13, 2025
Method of forming protective layer utilized in silicon remove process
UNITED MICROELECTRONICS CORP0 citations49