Inventor
OGA AKIRA
JP19 patents
⚠️ This page may combine multiple inventors who share the name “OGA AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
9 patentsUS7246657B2Jul 24, 2007
Air conditioner for vehicle
DENSO CORP8 citations73
US10214125B2Feb 26, 2019
Air-circulation promotion apparatus for vehicle
DENSO CORP3 citations68
US10675944B2Jun 9, 2020
Vehicular air conditioner
DENSO CORP1 citations62
US10493822B2Dec 3, 2019
Radiant heater device
DENSO CORP1 citations61
US10703168B2Jul 7, 2020
Occupant detection system, and vehicular air conditioner having the same
DENSO CORP0 citations51
US10894460B2Jan 19, 2021
Occupant detection system
DENSO CORP0 citations50
US10004111B2Jun 19, 2018
In-vehicle radiant heater control apparatus
DENSO CORP1 citations49
US10618375B2Apr 14, 2020
Vehicular air-conditioner
DENSO CORP0 citations41
US10434840B2Oct 8, 2019
Control system for radiant heating device
DENSO CORP0 citations41
MATSUSHITA ELECTRONICS CORP
3 patentsUS6225146B1May 1, 2001
Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device
MATSUSHITA ELECTRONICS CORP247 citations99
US5977615ANov 2, 1999
Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device
MATSUSHITA ELECTRONICS CORP159 citations99
US5708295AJan 13, 1998
Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same
MATSUSHITA ELECTRONICS CORP10 citations74
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
3 patentsUS6984880B2Jan 10, 2006
Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD34 citations90
US6720207B2Apr 13, 2004
Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD21 citations90
US6645792B2Nov 11, 2003
Lead frame and method for fabricating resin-encapsulated semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD10 citations71
PANASONIC CORP
3 patentsUS7508055B2Mar 24, 2009
High heat release semiconductor and method for manufacturing the same
PANASONIC CORP4 citations59
US8039932B2Oct 18, 2011
Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor device
PANASONIC CORP0 citations51
USD600219SSep 15, 2009
Lead frame
PANASONIC CORP0 citations50