Inventor
CHEN YENHENG
CN54 patents
Patents
50 patentsUS11211687B2Dec 28, 2021
Method of fabricating a semiconductor structure with an antenna module
SJ SEMICONDUCTOR JIANGYIN CORP3 citations72
US10777876B2Sep 15, 2020
Antenna feeder package structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP1 citations72
US10714435B2Jul 14, 2020
Fan-out antenna packaging structure and method making the same
SJ SEMICONDUCTOR JIANGYIN CORP2 citations72
US10325786B1Jun 18, 2019
Double-sided plastic fan-out package structure having antenna and manufacturing method thereof
SJ SEMICONDUCTOR JIANGYIN CORP2 citations72
US11316252B2Apr 26, 2022
Antenna packaging structure and method for forming the same
SJ SEMICONDUCTOR JIANGYIN CORP2 citations71
US11508675B2Nov 22, 2022
Semiconductor package structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP3 citations68
US11728558B2Aug 15, 2023
Semiconductor structure including antenna
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11699840B2Jul 11, 2023
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11605604B2Mar 14, 2023
Fan-out antenna packaging structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11502392B2Nov 15, 2022
Packaging structure and packaging method for antenna
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11488915B2Nov 1, 2022
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11437707B2Sep 6, 2022
Antenna feeder package structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11302658B2Apr 12, 2022
Fan-out antenna package structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11289435B2Mar 29, 2022
Fan-out antenna packaging structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11289793B2Mar 29, 2022
Semiconductor packaging structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11283152B2Mar 22, 2022
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11228087B2Jan 18, 2022
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11211343B2Dec 28, 2021
Fan-out antenna packaging structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11114391B2Sep 7, 2021
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US10886243B2Jan 5, 2021
Fan-out antenna packaging structure and preparation thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US10886594B2Jan 5, 2021
Packaging structure and packaging method for antenna
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US10770394B2Sep 8, 2020
Fan-out semiconductor packaging structure with antenna module and method making the same
SJ SEMICONDUCTOR JIANGYIN CORP1 citations62
US11257772B2Feb 22, 2022
Fan-out antenna packaging structure and preparation method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations60
US12588544B2Mar 24, 2026
Packaging structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US12525581B2Jan 13, 2026
Pop structure of three-dimensional fan-out memory and packaging method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US12283493B2Apr 22, 2025
Packaging structure radiating electromagnetic waves in horizontal direction and method making the same
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US12198942B2Jan 14, 2025
Packaging structure and method for preparing same
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US12119295B2Oct 15, 2024
Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US12113045B2Oct 8, 2024
Three-dimensional stacked fan-out packaging structure and method making the same
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US12040546B2Jul 16, 2024
Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the same
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11973070B2Apr 30, 2024
Double-layer stacked 3D fan-out packaging structure and method making the same
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11894243B2Feb 6, 2024
Wafer system-level fan-out packaging structure and manufacturing method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11894357B2Feb 6, 2024
System-level packaging structure and method for LED chip
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11756942B2Sep 12, 2023
Fan-out packaging structure and method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11756871B2Sep 12, 2023
Fan-out packaging structure and method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11749657B2Sep 5, 2023
Fan-out packaging structure and method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11735564B2Aug 22, 2023
Three-dimensional chip packaging structure and method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11133568B2Sep 28, 2021
Semiconductor package structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US10916829B2Feb 9, 2021
Semiconductor package structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US10854476B2Dec 1, 2020
Semiconductor vertical wire bonding structure and method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US10804229B2Oct 13, 2020
Fan-out antenna package structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US10777516B2Sep 15, 2020
Fan-out antenna packaging structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11515269B2Nov 29, 2022
Semiconductor packaging structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US11322852B2May 3, 2022
Lens antenna packaging structure, preparation method and electronic device
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US11316247B2Apr 26, 2022
Semiconductor packaging structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US10854951B2Dec 1, 2020
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US10573609B2Feb 25, 2020
Fan-out antenna packaging structure and preparation thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US10777515B2Sep 15, 2020
Fan-out antenna packaging structure and preparation method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations50
US12512411B2Dec 30, 2025
Wafer-level ASIC 3D integrated substrate, packaging device and preparation method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations49
US12482759B2Nov 25, 2025
Wafer-level ASIC 3D integrated substrate, packaging device and preparation method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations49
Showing the top 50 of 54 patents by PatentIndex Score.