Inventor
LIN JANGSHEN
CN29 patents
Patents
29 patentsUS11211687B2Dec 28, 2021
Method of fabricating a semiconductor structure with an antenna module
SJ SEMICONDUCTOR JIANGYIN CORP3 citations72
US10777876B2Sep 15, 2020
Antenna feeder package structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP1 citations72
US10714435B2Jul 14, 2020
Fan-out antenna packaging structure and method making the same
SJ SEMICONDUCTOR JIANGYIN CORP2 citations72
US10325786B1Jun 18, 2019
Double-sided plastic fan-out package structure having antenna and manufacturing method thereof
SJ SEMICONDUCTOR JIANGYIN CORP2 citations72
US11728558B2Aug 15, 2023
Semiconductor structure including antenna
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11699840B2Jul 11, 2023
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11502392B2Nov 15, 2022
Packaging structure and packaging method for antenna
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11488915B2Nov 1, 2022
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11437707B2Sep 6, 2022
Antenna feeder package structure and packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11289793B2Mar 29, 2022
Semiconductor packaging structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11283152B2Mar 22, 2022
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11228087B2Jan 18, 2022
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US11114391B2Sep 7, 2021
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US10886594B2Jan 5, 2021
Packaging structure and packaging method for antenna
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US10886243B2Jan 5, 2021
Fan-out antenna packaging structure and preparation thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations62
US10770394B2Sep 8, 2020
Fan-out semiconductor packaging structure with antenna module and method making the same
SJ SEMICONDUCTOR JIANGYIN CORP1 citations62
US11257772B2Feb 22, 2022
Fan-out antenna packaging structure and preparation method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations60
US12198942B2Jan 14, 2025
Packaging structure and method for preparing same
SJ SEMICONDUCTOR JIANGYIN CORP0 citations52
US11515269B2Nov 29, 2022
Semiconductor packaging structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US11322852B2May 3, 2022
Lens antenna packaging structure, preparation method and electronic device
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US11316247B2Apr 26, 2022
Semiconductor packaging structure having antenna module
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US10854951B2Dec 1, 2020
Antenna package structure and antenna packaging method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US10573609B2Feb 25, 2020
Fan-out antenna packaging structure and preparation thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations51
US10777515B2Sep 15, 2020
Fan-out antenna packaging structure and preparation method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations50
US12512411B2Dec 30, 2025
Wafer-level ASIC 3D integrated substrate, packaging device and preparation method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations49
US12482759B2Nov 25, 2025
Wafer-level ASIC 3D integrated substrate, packaging device and preparation method
SJ SEMICONDUCTOR JIANGYIN CORP0 citations49
US10636779B2Apr 28, 2020
Packaging device for integrated power supply system and packaging method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations43
US10872867B2Dec 22, 2020
Fan-out antenna packaging structure and preparation method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations39
US10872868B2Dec 22, 2020
Fan-out antenna packaging structure and preparation method thereof
SJ SEMICONDUCTOR JIANGYIN CORP0 citations39