Inventor
YANG YU-SIN
KR66 patents
⚠️ This page may combine multiple inventors who share the name “YANG YU-SIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
44 patentsUS6803241B2Oct 12, 2004
Method of monitoring contact hole of integrated circuit using corona charges
SAMSUNG ELECTRONICS CO LTD19 citations92
US7186280B2Mar 6, 2007
Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the method
SAMSUNG ELECTRONICS CO LTD14 citations83
US11037283B2Jun 15, 2021
Inspecting apparatus based on hyperspectral imaging
SAMSUNG ELECTRONICS CO LTD7 citations82
US9659743B2May 23, 2017
Image creating method and imaging system for performing the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US7428328B2Sep 23, 2008
Method of forming a three-dimensional image of a pattern to be inspected and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD7 citations73
US9934939B2Apr 3, 2018
Scanning electron microscope system capable of measuring in-cell overlay offset using high-energy electron beam and method thereof
SAMSUNG ELECTRONICS CO LTD5 citations72
US9831626B2Nov 28, 2017
Broadband light source and optical inspector having the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9733178B2Aug 15, 2017
Spectral ellipsometry measurement and data analysis device and related systems and methods
SAMSUNG ELECTRONICS CO LTD3 citations72
US9036895B2May 19, 2015
Method of inspecting wafer
SAMSUNG ELECTRONICS CO LTD6 citations72
US6911662B2Jun 28, 2005
Chemical-mechanical polishing apparatus and method for controlling the same
SAMSUNG ELECTRONICS CO LTD10 citations72
US10249544B2Apr 2, 2019
Method of inspecting surface and method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US8841824B2Sep 23, 2014
Broadband light illuminators
SAMSUNG ELECTRONICS CO LTD5 citations71
US10001444B2Jun 19, 2018
Surface inspecting method
SAMSUNG ELECTRONICS CO LTD4 citations70
US6650408B2Nov 18, 2003
Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus
SAMSUNG ELECTRONICS CO LTD12 citations70
US10373796B2Aug 6, 2019
Method of inspecting wafer using electron beam
SAMSUNG ELECTRONICS CO LTD2 citations68
US10559506B2Feb 11, 2020
Method of inspecting semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations65
US8055056B2Nov 8, 2011
Method of detecting defects of patterns on a semiconductor substrate and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US8050488B2Nov 1, 2011
Method of analyzing a wafer sample
SAMSUNG ELECTRONICS CO LTD6 citations63
US7804591B2Sep 28, 2010
Wafer inspecting method
SAMSUNG ELECTRONICS CO LTD3 citations63
US7426031B2Sep 16, 2008
Method and apparatus for inspecting target defects on a wafer
SAMSUNG ELECTRONICS CO LTD4 citations63
US7113274B2Sep 26, 2006
Method and apparatus for inspecting a substrate
SAMSUNG ELECTRONICS CO LTD2 citations63
US10969428B2Apr 6, 2021
Method of inspecting pattern defect
SAMSUNG ELECTRONICS CO LTD0 citations62
US9123503B2Sep 1, 2015
Methods of fabricating microelectronic substrate inspection equipment
SAMSUNG ELECTRONICS CO LTD3 citations62
US8055057B2Nov 8, 2011
Method for detecting defects in a substrate having a semiconductor device thereon
SAMSUNG ELECTRONICS CO LTD2 citations62
US8034640B2Oct 11, 2011
Apparatus and method to inspect defect of semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations62
US7433032B2Oct 7, 2008
Method and apparatus for inspecting defects in multiple regions with different parameters
SAMSUNG ELECTRONICS CO LTD2 citations62
US7310140B2Dec 18, 2007
Method and apparatus for inspecting a wafer surface
SAMSUNG ELECTRONICS CO LTD2 citations62
US7271890B2Sep 18, 2007
Method and apparatus for inspecting defects
SAMSUNG ELECTRONICS CO LTD2 citations62
US11043433B2Jun 22, 2021
Method of inspecting surface and method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations61
US7697130B2Apr 13, 2010
Apparatus and method for inspecting a surface of a wafer
SAMSUNG ELECTRONICS CO LTD3 citations61
US7446865B2Nov 4, 2008
Method of classifying defects
SAMSUNG ELECTRONICS CO LTD3 citations61
US8034641B2Oct 11, 2011
Method for inspection of defects on a substrate
SAMSUNG ELECTRONICS CO LTD5 citations60
US7486392B2Feb 3, 2009
Method of inspecting for defects and apparatus for performing the method
SAMSUNG ELECTRONICS CO LTD6 citations60
US7385689B2Jun 10, 2008
Method and apparatus for inspecting substrate pattern
SAMSUNG ELECTRONICS CO LTD5 citations60
US6927077B2Aug 9, 2005
Method and apparatus for measuring contamination of a semiconductor substrate
SAMSUNG ELECTRONICS CO LTD4 citations60
US11181831B2Nov 23, 2021
Methods of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US10593032B2Mar 17, 2020
Defect inspection method and defect inspection apparatus
SAMSUNG ELECTRONICS CO LTD1 citations59
US6850332B2Feb 1, 2005
Method for measuring step difference in a semiconductor device and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD2 citations59
US9261532B1Feb 16, 2016
Conductive atomic force microscope and method of operating the same
SAMSUNG ELECTRONICS CO LTD2 citations57
US7394279B2Jul 1, 2008
Method of measuring a surface voltage of an insulating layer
SAMSUNG ELECTRONICS CO LTD4 citations57
US7573568B2Aug 11, 2009
Method and apparatus for detecting a photolithography processing error, and method and apparatus for monitoring a photolithography process
SAMSUNG ELECTRONICS CO LTD1 citations52
US8759763B2Jun 24, 2014
Method and apparatus to measure step height of device using scanning electron microscope
SAMSUNG ELECTRONICS CO LTD1 citations51
US6870948B2Mar 22, 2005
Method and apparatus for numerically analyzing grain growth on semiconductor wafer using SEM image
SAMSUNG ELECTRONICS CO LTD1 citations51
US9255694B2Feb 9, 2016
Reflector structure of illumination optic system
SAMSUNG ELECTRONICS CO LTD0 citations50
YANG YU-SIN
2 patentsUS8126258B2Feb 28, 2012
Method of detecting defects in patterns on semiconductor substrate by comparing second image with reference image after acquiring second image from first image and apparatus for performing the same
YANG YU-SIN9 citations82
US8184899B2May 22, 2012
Method of detecting a defect on an object
YANG YU-SIN3 citations54
YUN SEONG-JIN
1 patentSAMSUNG ELECTRIC
1 patentSOHN YOUNG-HOON
1 patentKIM MIN-KOOK
1 patentShowing the top 50 of 66 patents by PatentIndex Score.