Inventor

LEE SHIH-CHANG

TW82 patents

⚠️ This page may combine multiple inventors who share the name “LEE SHIH-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE SHIH-CHANG

EPISTAR CORP

Light-emitting device

Light-emitting device and manufacturing method thereof

Light-emitting device

Light-emitting array

Optical sensing device and optical sensing system thereof comprising a light receiving device capable of receiving a first received wavelength having a largest external quantum efficiency

Light-emitting device

Light-emitting device and manufacturing method thereof

Light-emitting device

Optoelectronic device and the manufacturing method thereof

Semiconductor light-emitting device and semiconductor light-emitting component

Method for reusing a substrate for making light-emitting device

Light-emitting device

Light-emitting device

Light-emitting device and manufacturing method thereof

Light emitting diode

Light-emitting diode

Light-emitting device

Light-emitting device and manufacturing method thereof

Semiconductor device and package structure

Semiconductor device

Optical sensing device and optical sensing system thereof comprising light emitting device and light receiving device completely sandwiched by the topmost surface and bottommost surface of a carrier body with different vertically separated distances

Semiconductor photo-detecting device

Semiconductor device

ADVANCED SEMICONDUCTOR ENG

Chip package structure and manufacturing method thereof

Thermal enhance MCM package and manufacturing method thereof

Multi-chips module assembly package

Substrate strip for use in packaging semiconductor chips

Flexible substrate based ball grid array (BGA) package

Stacked package module

Flip chip package structure

Flip chip package

Flip chip interconnected structure and a fabrication method thereof

Method of making leadless semiconductor package

Molding apparatus for flexible substrate based package

Method of forming bumps

Method of forming bumps

Semiconductor chip package and manufacturing method thereof

Semiconductor package

Molding apparatus and molding method for flexible substrate based package

Method for fabricating a flexible substrate based ball grid array (BGA) package

Substrate strip for use in packaging semiconductor chips and method for making the substrate strip

Semiconductor chip package

Contact sensor package

NAT APPLIED RES LABORATORIES

Heterogeneously integrated semiconductor device and manufacturing method thereof

Heterogeneously integrated semiconductor device and manufacturing method thereof

LEE CHUNG-SHU

Transformer with conductive plate winding structure

HONG KAI-YI

Electromagnetic wave gathering device and solar cell module having the same

LIN YI-CHIEH

Solar cell devices and apparatus comprising the same

CHICONY POWER TECH CO LTD

Two-stage balancer for multi-lamp backlight

LEE SHIH-CHANG

Power supply apparatus with current-sharing function