Inventor

LAY MING-YI

TW3 patents

⚠️ This page may combine multiple inventors who share the name “LAY MING-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AU OPTRONICS CORP

2 patents

US7041589B2May 9, 2006

Metal bump with an insulating sidewall and method of fabricating thereof

AU OPTRONICS CORP25 citations88

US6958539B2Oct 25, 2005

Metal bump with an insulating sidewall and method of fabricating thereof

AU OPTRONICS CORP27 citations88

WINBOND ELECTRONICS CORP

1 patent

US6489783B1Dec 3, 2002

Test device and method

WINBOND ELECTRONICS CORP22 citations90