Inventor
WANG CHAO-HSUN
TW62 patents
Patents
50 patentsUS10923573B2Feb 16, 2021
Forming metal contacts on metal gates
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9779984B1Oct 3, 2017
Method of forming trenches with different depths
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11189525B2Nov 30, 2021
Via-first process for connecting a contact and a gate electrode
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11961886B2Apr 16, 2024
Semiconductor structure with conductive structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US12176435B2Dec 24, 2024
Method for forming fin field effect transistor (FinFET) device structure with conductive layer between gate and gate contact
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11532561B2Dec 20, 2022
Different via configurations for different via interface requirements
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11227950B2Jan 18, 2022
Methods of forming air spacers in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10861740B2Dec 8, 2020
Method of forming trenches with different depths
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10535555B2Jan 14, 2020
Contact plugs and methods forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10418453B2Sep 17, 2019
Forming metal contacts on metal gates
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10269621B2Apr 23, 2019
Contact plugs and methods forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10163703B2Dec 25, 2018
Method for forming self-aligned contact
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11527614B2Dec 13, 2022
Semiconductor structure with conductive structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11322394B2May 3, 2022
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12057392B2Aug 6, 2024
Conductive features having varying resistance
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11227830B2Jan 18, 2022
Conductive features having varying resistance
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10950728B2Mar 16, 2021
Fin field effect transistor (FinFET) device structure with isolation layer and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12266703B2Apr 1, 2025
Dielectric structures for semiconductor device structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12593670B2Mar 31, 2026
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12406907B2Sep 2, 2025
Semiconductor structure with conductive_structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12389646B2Aug 12, 2025
Semiconductor transistor structure with nanostructures and conductive structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12342598B2Jun 24, 2025
Forming metal contacts on metal gates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278188B2Apr 15, 2025
Different via configurations for different via interface requirements
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12243940B2Mar 4, 2025
Methods of forming air spacers in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12211787B2Jan 28, 2025
Interconnect structures and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12142565B2Nov 12, 2024
Different via configurations for different via interface requirements
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125743B2Oct 22, 2024
Via-first process for connecting a contact and a gate electrode
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12074063B2Aug 27, 2024
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11915971B2Feb 27, 2024
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901426B2Feb 13, 2024
Forming metal contacts on metal gates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855154B2Dec 26, 2023
Vertical interconnect features and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11682729B2Jun 20, 2023
Methods of forming air spacers in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11682579B2Jun 20, 2023
Method of forming trenches with different depths
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670544B2Jun 6, 2023
Via-first process for connecting a contact and a gate electrode
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11640936B2May 2, 2023
Interconnect structures and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11532717B2Dec 20, 2022
Forming metal contacts on metal gates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11508822B2Nov 22, 2022
Source/drain via having reduced resistance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11348830B2May 31, 2022
Method of forming trenches with different depths
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11271112B2Mar 8, 2022
Method for forming fin field effect transistor (FINFET) device structure with conductive layer between gate and gate contact
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11177212B2Nov 16, 2021
Contact formation method and related structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11127684B2Sep 21, 2021
Low-resistance interconnect structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11107896B2Aug 31, 2021
Vertical interconnect features and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12506034B2Dec 23, 2025
Polishing interconnect structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11978664B2May 7, 2024
Polishing interconnect structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11430691B2Aug 30, 2022
Polishing interconnect structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10755945B2Aug 25, 2020
Metal contacts on metal gates and methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12107166B2Oct 1, 2024
Fin field effect transistor (FinFET) device structure with isolation layer and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12543553B2Feb 3, 2026
Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10790197B2Sep 29, 2020
Semiconductor arrangement and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510614B2Dec 17, 2019
Semiconductor arrangement and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
Showing the top 50 of 62 patents by PatentIndex Score.