Inventor

KAO CHEN-YUAN

TW52 patents

⚠️ This page may combine multiple inventors who share the name “KAO CHEN-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KAO CHEN-YUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Interconnect structure and method

Multi-layer film device and method

Methods for forming contact plugs with reduced corrosion

Forming metal contacts on metal gates

Multi-layer film device and method

Methods for forming contact plugs with reduced corrosion

Interconnect structure and method

Multi-layer film device and method

Methods for forming contact plugs with reduced corrosion

Method for forming fin field effect transistor (FinFET) device structure with conductive layer between gate and gate contact

Chemical direct pattern plating method

Electro-plating and apparatus for performing the same

Different via configurations for different via interface requirements

Interconnect structure and method

Forming metal contacts on metal gates

Electro-plating and apparatus for performing the same

Common rail contact

Metal cap apparatus and method

Interconnect structures including a fin structure and a metal cap

Systems and methods of compensating for filling material losses in electroplating processes

Forming metal contacts on metal gates

Different via configurations for different via interface requirements

Multi-layer film device and method

Chemical direct pattern plating method

Different via configurations for different via interface requirements

Forming metal contacts on metal gates

Vertical interconnect features and methods of forming

Multi-layer film device and method

Forming metal contacts on metal gates

Interconnect structure and method

Method for forming fin field effect transistor (FINFET) device structure with conductive layer between gate and gate contact

Vertical interconnect features and methods of forming

Chemical direct pattern plating method

Methods for forming contact plugs with reduced corrosion

Metal contacts on metal gates and methods thereof

Pre-clean for contacts

Chemical direct pattern plating method

Electro-plating and apparatus for performing the same

Fin field effect transistor (FinFET) device structure with conductive layer between gate and gate contact

Method for forming semiconductor device structure

Semiconductor device structure and method for forming the same

Chemical direct pattern plating interconnect metallization and metal structure produced by the same

GLOBAL UNICHIP CORP

Capture IR drop analyzer and analyzing method thereof

Fixing device for clock tree and fixing method thereof

Circuit correction system and method for increasing coverage of scan test

Testing circuit

Apparatus for adjusting skew of circuit signal and adjusting method thereof

PAPOUTSAKIS ELEFTHERIOS

Megakaryocytic particles and microparticles for cell therapy and fate modification of stem and progenitor cells

Megakaryocytic particles and microparticles for in vivo hematopoietic cell and gene therapies

TAIWAN SEMICONDUCTOR MFG

Metal cap apparatus and method