Inventor

LU BAU-RU

TW43 patents

⚠️ This page may combine multiple inventors who share the name “LU BAU-RU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LU BAU-RU

CYNTEC CO LTD

Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor

Stack frame for electrical connections and the method to fabricate thereof

Inductive component and package structure thereof

Stack frame for electrical connections and the method to fabricate thereof

Electronic module and the fabrication method thereof

Stacked electronic structure

Three-dimensional package structure and the method to fabricate thereof

Electronic module with a magnetic device

Electronic package structure

Electronic module

Stack frame for electrical connections and the method to fabricate thereof

Electronic module

Encapsulated electronic device mounted on a redistribution layer

Three-dimensional package structure and the method to fabricate thereof

Substrate and the method to fabricate thereof

Chip package structure

Package structure

Stacked electronic structure

Method to form a stacked electronic structure

Stack frame for electrical connections and the method to fabricate thereof

Stacked electronic structure

Circuit module having surface-mount pads on a lateral surface for connecting with a circuit board

Electronic package structure

Electronic module

Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure

Electronic module with a magnetic device

Substrate and the method to fabricate thereof

Package structure and the method to fabricate thereof

Electronic package structure comprising a magnetic body and an inductive element and method for making the same

Electronic module and method for forming package

LU BAU-RU

Stack frame for electrical connections and the method to fabricate thereof

Stack frame for electrical connections and the method to fabricate thereof

Method of fabrication of encapsulated electronics devices mounted on a redistribution layer

Package structure and the method to fabricate thereof

Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the same

DELTA ELECTRONICS SHANGHAI CO

Power supply module used in a smart terminal and power supply module assembly structure

Power supply module used in a smart terminal and power supply module assembly structure

WEN CHAU-CHUN

Chip package structure including heat dissipation device and an insulation sheet

LEE HAN-HSIANG

Electronic package structure

CHEN DA-JUNG

Electronic package structure

HUANG CHI-FENG

Metal core printed circuit board and electronic package structure

LU BAU RU

Package structure and the method to fabricate thereof

LI JENG JEN

Package structure and the method to fabricate thereof