Inventor

KWON WONLL

KR3 patents

⚠️ This page may combine multiple inventors who share the name “KWON WONLL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM MINJUNG

1 patent

US8710670B2Apr 29, 2014

Integrated circuit packaging system with coupling features and method of manufacture thereof

KIM MINJUNG7 citations81

CHOI DAESIK

1 patent

US8642469B2Feb 4, 2014

Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer

CHOI DAESIK2 citations59

STATS CHIPPAC LTD

1 patent

US9252093B2Feb 2, 2016

Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer

STATS CHIPPAC LTD0 citations49