Inventor

Wu ming xia

CN2 patents

Patents

2 patents

US10483239B2Nov 19, 2019

Semiconductor device including dual pad wire bond interconnection

SANDISK SEMICONDUCTOR SHANGHAI CO LTD5 citations64

US10128218B2Nov 13, 2018

Semiconductor device including die bond pads at a die edge

SANDISK SEMICONDUCTOR SHANGHAI CO LTD0 citations47