Inventor

WU JIUN-YI

TW216 patents

⚠️ This page may combine multiple inventors who share the name “WU JIUN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU JIUN-YI

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit package and methods of forming same

Redistribution structures in semiconductor packages and methods of forming same

Hybrid integrated circuit package and method

Substrate design for semiconductor packages and method of forming same

Package-on-package structure with organic interposer

Wafer level package structure and method of forming same

Hybrid integrated circuit package and method

Semiconductor device and method of manufacture

Integrated circuit package and method

Circuit board, semiconductor device including the same, and manufacturing method thereof

Protrusion bump pads for bond-on-trace processing

Semiconductor package structure and manufacturing method thereof

Protrusion bump pads for bond-on-trace processing

Wafer level package structure and method of forming same

Semiconductor structure and method of fabricating the same

Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolation

Package on packaging structure and methods of making same

Protrusion bump pads for bond-on-trace processing

Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same

Integrated circuit package and method of forming same

Electronics card including multi-chip module

Photonic package and method of manufacture

Semiconductor device and method of manufacture

Semiconductor device and method of manufacture

Warpage control of packages using embedded core frame

Package structure and method of forming the same

Symmetrical substrate for semiconductor packaging

Semiconductor device package and methods of manufacture

Wafer level package structure and method of forming same

Semiconductor device and method of manufacture

Semiconductor packages and methods of forming the same

Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines

Electronics card including multi-chip module

Semiconductor device and method of manufacture

Hybrid integrated circuit package and method

Semiconductor package and method

Symmetrical substrate for semiconductor packaging

YU CHEN-HUA

Package on package devices and methods of packaging semiconductor dies

Package on package devices and methods of forming same

Substrate contact opening

Package structures and methods for forming the same

TAIWAN SEMICONDUCTOR MFG

Pop joint through interposer

Protrusion bump pads for bond-on-trace processing

Package on-package with cavity in interposer

Optical clock signal distribution using through-silicon vias

WANG TSUNG-DING

Package on package devices and methods of packaging semiconductor dies

WU JIUN YI

Interposer frame and method of manufacturing the same

YEW MING-CHIH

Packaging structures and methods for semiconductor devices

LII MIRNG-JI

Rigid interconnect structures in package-on-package assemblies

CHEN YU-FENG

Extending metal traces in bump-on-trace structures