Inventor
HUANG CHEN-HAO
TW18 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHEN-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS11327228B2May 10, 2022
Photonic device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11175452B1Nov 16, 2021
Photonic device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11940659B2Mar 26, 2024
Optical integrated circuit structure including edge coupling protective features and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11892678B2Feb 6, 2024
Photonic device and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12353034B2Jul 8, 2025
Optical integrated circuit structure including edge coupling protective features and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12169308B2Dec 17, 2024
Method of using fiber to chip coupler and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12153255B2Nov 26, 2024
Method of making photonic device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12072534B2Aug 27, 2024
Fiber to chip coupler and method of using
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12050348B2Jul 30, 2024
Fiber to chip coupler and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11892681B2Feb 6, 2024
Fiber to chip coupler and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11848390B2Dec 19, 2023
Capping structures for germanium-containing photovoltaic components and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11740409B2Aug 29, 2023
Photonic device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11532759B2Dec 20, 2022
Capping structures for germanium-containing photovoltaic components and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11442230B2Sep 13, 2022
Silicon photonics coupling structure using an etch stop layer and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51