Inventor

WUERFL JOACHIM

DE4 patents

⚠️ This page may combine multiple inventors who share the name “WUERFL JOACHIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KRUEGER OLAF

2 patents

US8158514B2Apr 17, 2012

Method for producing vertical electrical contact connections in semiconductor wafers

KRUEGER OLAF21 citations84

US8455355B2Jun 4, 2013

Method for producing through-contacts in semi-conductor wafers via production of through-plated holes

KRUEGER OLAF0 citations31

BAHAT-TREIDEL ELDAT

1 patent

US8866191B2Oct 21, 2014

HEMT semiconductor component with field plates

BAHAT-TREIDEL ELDAT6 citations59

SIDOROV VICTOR

1 patent

US8648466B2Feb 11, 2014

Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad

SIDOROV VICTOR1 citations39