Inventor
SANKARAPILLAI CHIRAYARIKATHUVE
SG3 patents
Patents
3 patentsUS7326629B2Feb 5, 2008
Method of stacking thin substrates by transfer bonding
AGENCY SCIENCE TECH & RES105 citations95
US7183176B2Feb 27, 2007
Method of forming through-wafer interconnects for vertical wafer level packaging
AGENCY SCIENCE TECH & RES57 citations92
US7381629B2Jun 3, 2008
Method of forming through-wafer interconnects for vertical wafer level packaging
AGENCY SCIENCE TECH & RES3 citations58