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LIEU PETER
US
2 patents
Patents
2 patents
US8586407B2
Nov 19, 2013
Method for depackaging prepackaged integrated circuit die and a product from the method
LIEU PETER
2 citations
51
US8609473B2
Dec 17, 2013
Method for fabricating a neo-layer using stud bumped bare die
LIEU PETER
0 citations
32