Inventor
KRONMUELLER SILVIA
DE28 patents
⚠️ This page may combine multiple inventors who share the name “KRONMUELLER SILVIA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BOSCH GMBH ROBERT
20 patentsUS6936491B2Aug 30, 2005
Method of fabricating microelectromechanical systems and devices having trench isolated contacts
BOSCH GMBH ROBERT167 citations99
US7075160B2Jul 11, 2006
Microelectromechanical systems and devices having thin film encapsulated mechanical structures
BOSCH GMBH ROBERT65 citations98
US6952041B2Oct 4, 2005
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
BOSCH GMBH ROBERT42 citations96
US7859067B2Dec 28, 2010
Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating same
BOSCH GMBH ROBERT11 citations92
US7579206B2Aug 25, 2009
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
BOSCH GMBH ROBERT14 citations92
US7352040B2Apr 1, 2008
Microelectromechanical systems having trench isolated contacts, and methods for fabricating same
BOSCH GMBH ROBERT28 citations92
US7317233B2Jan 8, 2008
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
BOSCH GMBH ROBERT15 citations92
US7288824B2Oct 30, 2007
Microelectromechanical systems, and devices having thin film encapsulated mechanical structures
BOSCH GMBH ROBERT15 citations92
US7262071B2Aug 28, 2007
Micromechanical component and suitable method for its manufacture
BOSCH GMBH ROBERT20 citations92
US7514283B2Apr 7, 2009
Method of fabricating electromechanical device having a controlled atmosphere
BOSCH GMBH ROBERT10 citations84
US7834409B2Nov 16, 2010
Micromechanical component and corresponding method for its manufacture
BOSCH GMBH ROBERT14 citations83
US7582514B2Sep 1, 2009
Microelectromechanical systems encapsulation process with anti-stiction coating
BOSCH GMBH ROBERT9 citations82
US7625603B2Dec 1, 2009
Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics
BOSCH GMBH ROBERT6 citations74
US7898046B2Mar 1, 2011
Microelectromechanical systems encapsulation process
BOSCH GMBH ROBERT5 citations73
US7563633B2Jul 21, 2009
Microelectromechanical systems encapsulation process
BOSCH GMBH ROBERT5 citations73
US7270868B2Sep 18, 2007
Micromechanical component
BOSCH GMBH ROBERT5 citations62
US7851248B2Dec 14, 2010
Method for producing a micromechanical component having a thin-layer capping
BOSCH GMBH ROBERT3 citations60
US8018077B2Sep 13, 2011
Electromechanical system having a controlled atmosphere, and method of fabricating same
BOSCH GMBH ROBERT0 citations52
US7382031B2Jun 3, 2008
Component including a fixed element that is in a silicon layer and is mechanically connected to a substrate via an anchoring element and method for its manufacture
BOSCH GMBH ROBERT1 citations52
US9035413B2May 19, 2015
Semiconductor device with embedded converter element and production method for a semiconductor device with an embedded converter element
BOSCH GMBH ROBERT0 citations41
PARTRIDGE AARON
4 patentsUS8421167B2Apr 16, 2013
Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same
PARTRIDGE AARON1 citations62
US9771257B2Sep 26, 2017
Electromechanical system having a controlled atmosphere, and method of fabricating same
PARTRIDGE AARON0 citations51
US8623686B2Jan 7, 2014
Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same
PARTRIDGE AARON0 citations51
US8287956B2Oct 16, 2012
Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics
PARTRIDGE AARON0 citations51
LAMMEL GERHARD
2 patentsUS8492850B2Jul 23, 2013
Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type
LAMMEL GERHARD0 citations51
US8148234B2Apr 3, 2012
Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure
LAMMEL GERHARD0 citations51