Inventor
TING CHUNG-CHIEH
TW4 patents
Patents
4 patentsUS12020952B2Jun 25, 2024
Method of fabricating semiconductor device having dummy micro bumps between stacking dies
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11101145B2Aug 24, 2021
Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12217999B2Feb 4, 2025
Trench isolation process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11443976B2Sep 13, 2022
Trench isolation process
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations58